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CSP/BallNest Hybrid SOCKET |
Suitable for prototyping, test, or burn-in of CSP, BGA, μBGA and LGA devices.
ZIF style socket using Aries "Touchspring" contacts. |
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BallNest SOCKET |
Socket lid nests BGA package into female socket for a reliable, solderless electrical connection.
Reliable, 4-fingered contact with wiping action. |
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BGA ADAPTER |
Converts softball BGA devices into pluggable hardball devices.
Any grid size available from 1.00 - 1.5mm pitch.
Corner locating pins aid in assembly. |
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BGA SOCKET |
Any grid size available from 1.00mm - 1.5mm pitch.
Lidless design - pin presses into contact.
Corner locating pins aid in assembly |
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CSP BGA SMT TEST & BURN-IN SOCKETS |
Clamshell Precise IC fit.
SMT Design for Test and Burn-in for any SMT Device. |
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PINBALL DIRECT SOLDER BGA TEST SOCKETS |
Open Top Test Socket for direct solder SMT Applications
"X" & "Y" Stackable |
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LGA SOCKETS |
Designed for production LGA applications up to 2500 leads - low force <15g |
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